AN INVITATION TO AUTHORS
to present Brazing and Soldering Abstracts at the
AWS 37^th International Brazing and Soldering Symposium (IBSS)
Dedicated to the Memory of Carmen Paponetti
November 3, 2010 – Atlanta, GA
Submission Deadline April 16

The American Welding Society's C3 Committee on Brazing and Soldering (celebrating their 60th anniversary) invites you to submit your work for consideration to present at the planned Symposium. The program organizers are accepting extended abstracts (approximately 500 words) describing original, previously unpublished work. The work should pertain to current research, engineering and manufacturing applications, new technology developments, and potential future advancements in brazing and soldering.

An IBSS Proceedings will be published on a CD and provided to all those attending the symposium.

IBSS is held in conjunction with the International Brazing and Soldering Conference (IBSC). IBSC occurs every three years and is jointly organized by AWS and ASM International. The next IBSC is planned for 2012. Last year’s IBSC in Orlando, FL (April 2009) recognized the following best brazing and soldering papers:

• “Evaluation of Margins of Safety in Brazed Joints” by Yury Flom, Len Wang, & Mollie Powell, NASA/Goddard Space Flight Center, Greenbelt, Maryland, and Matthew Soffa & Monica Rommel, ITT Space Systems Div., Rochester, New York (Best Brazing Paper).
• “Alloy Design of Sn-Ag-Cu+X to Promote Eutectic Solidification” by I.E. Anderson, J.L. Harringa, and J.K. Walleser, Ames Laboratory / Iowa State University, Ames, Iowa (Best Soldering Paper).

All IBSS abstract submissions must be submitted by April 16.

Before submitting your extended abstract, we ask that you carefully consider your ability to present your work at the Symposium. Speakers are required to pay a nominal registration fee for the AWS Professional Program and are also responsible for their travel, housing and other related expenses. For aditional information call 800-443-9353 Ext. 237 (305-443-9353) or email nbradley@aws.org.

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AUTHOR APPLICATION FORM
for
37^th INTERNATIONAL BRAZING AND SOLDERING SYMPOSIUM
Atlanta, Georgia - November 3, 2010

Include with the completed form the required extended abstract (approximately 500 words) for consideration by no later than April 15. Primary Author (Full Name) Affiliation Email Mailing Address City State/Province Zip/Mail Code Country

Co-Author(s) Full Name Full Name Affiliation Affiliation Address Address City City State/Province State/Province Zip Code Zip Code Country Country Email Email   Full Name Full Name Affiliation Affiliation Address Address City City State/Province State/Province Zip Code Zip Code Country Country Email Email

Guidelines for submitting abstracts and selection criteria Only those abstracts submitted along with this form will be considered. Follow the guidelines and word limits indicated. Complete the form and submit it electronically

Proposed Title (10 words or less)

Upload Abstract

Subject Classifications 1. Classify your paper by choosing one of the appropriate selections in each of the following two groups     (a) and (b):     a. Applied Technology     Education     Research Oriented     b. Original Contribution     Progress Report     Review     Tutorial 2. Brazing/Soldering process(es) used 3. Materials used 4. The main emphasis is more Process Oriented     Materials Oriented 5. Industries that this paper most applies to 6. Has material in this paper ever been published or presented previously? Yes    No     If “Yes”, when and where? The symposium is being dedicated to the memory of Carmen Paponetti. Some of the topical areas that are being considered for IBSS are: Consideder Topics Aircraft and Aerospace Industries Automotive and Transportation Applications Brazing and Soldering Fundamentals Ceramic / Composite / Glass-to-Metal Joining Electronic Packaging / Sensors Fuel Cells Filler Metal Properties Fluxes and Atmospheres Furnace and Vacuum Brazing Induction and Torch Brazing Industrial Applications Inspection Techniques Interfacial Reactions and Properties Joint Design and Reliability Lead Free Solders Light Metals Materials and Process Characterization Modeling and Predictive Capabilities Nano and Reactive Joining Technologies Novel Brazing and Soldering Applications Power and Electrical Equipment Special / Advanced Processes Surface Finishes and Cleaning Test Methods and Evaluation MUST BE RECEIVED NO LATER THAN April 16, 2010